Panram International Corporation.

Panram International Corporation.

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Panram Launches High-Speed MLC Flash Particle Industrial SSD
High-Spec Solution

With the take off of Industry 4.0 and edge computing applications, the demand for fast data reading and writing is rising, and SSDs used in embedded systems need to be stable, reliable and fast to connect to storage devices. In response to this demand, Panram Technology, a well-known industrial control brand, has launched industrial grade SSDs with high efficiency MLC flash memory particles, up to R: 500MB/s and W: 300MB/s for 64GB and R: 500MB/s and W: 400MB/s for 128GB.

The complete product line of high efficiency SSDs includes 2.5" SSDs, Half Slim half-height SSDs, and M.2 2280/2242 form factors for customers to choose from, meeting the different needs of a wide range of customers. We also provide anti-sulfuration technology and PCBA coating (Conformal Coating) to provide a variety of high specification solutions for the industrial market.

With the anti-sulfuration module series, SSDs can be used in various high sulfur environments without worrying about the failure of the module due to sulfur intrusion. In high sulfur environments, including areas where petroleum, lubricants or fossil fuels are present, and industrial areas with high sulfur contamination, SSD modules without anti-sulfuration features are prone to produce harmful silver sulfide, which can lead to module failure and reduce the product's operating life.

It is suitable for various fields threatened by high pollution environment, such as industrial and automation, medical, transportation, military, power and communication base stations, etc. It not only can effectively avoid sulfide corrosion, but also can operate stably in harsh environment to meet customers' requirements for product reliability.

The PCBA coating protects the solder joints against various environmental conditions such as humidity, dust, corrosion and chemical contaminants, isolating the memory module from the harsh external environment of extreme cold and heat, and maintaining the module's operational stability.

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