- Panram Launches Next Generation DDR4 2666 Memory
With the expanding application of Industrial Internet of Things (IIoT), Artificial Intelligence (AI), and Internet of Things (IoT), the demand for intelligent application devices and servers is also rising. Panram Technology (Panram), a well-known industrial control brand, has officially released DDR4 2666MHz RDIMM and ECC UDIMM/SODIMM products to actively compete in the global server market. The DDR4 2666MHz RDIMM can reach a maximum capacity of 32GB, while the ECC module is suitable for general temperature and wide temperature operating environments.
According to DIGITIMES Research, the global server DRAM supply and demand is expected to climb by 8.5% in 2018, as the server market demand is growing year by year and there is still a certain demand for DRAM in cell phone and PC applications. The DDR4 2666 solution from Panram Technology offers an 11% performance improvement over the previous generation DDR4 2400 and a 20% reduction in power consumption compared to DDR3, resulting in significant improvements in transfer speed, performance, and power consumption for high performance and energy efficient operation.
In response to the harsh environment faced by industrial computers, Panram also introduces anti-sulfuration series memory modules. The anti-sulfuration modules are designed to withstand the harsh environment of high sulfur and do not need to worry about the sulfur intrusion and failure of the modules. In high sulfur environments, including places where petroleum, lubricants, or fossil fuels are present, and industrial areas with high sulfur pollution, memory modules without anti-sulfuration function are prone to produce harmful silver sulfide, which will cause module failure and reduce the product's operating life. It is suitable for various fields threatened by highly polluted environment, such as industrial and automation, medical, transportation, military, power and communication base stations, etc. It can not only effectively avoid sulfide corrosion, but also can operate stably in harsh environment to meet customers' requirements for product reliability.
In addition, Conformal Coating protects the solder joints against various environmental conditions such as humidity, dust, corrosion, and chemical contaminants, isolating the memory module from the harsh external environment of extreme heat and cold, and maintaining the stability of the module's operating performance.